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1/14 LWH1025 different and better - contents - 1. features 2. outline dimensions 3. package material 4. absolute ma ximum ratings 5. electrical optical characteristics 6. ranks 7. taping 8. packing struction 9. characteristic diagrams 10. precautions to taken 11. reliability 12. precautions in use 13. revision history sheet
2/14 LWH1025 different and better 1. features ? package : smd side view type ? yellow colored diffusion ? 2.8 1.2 0.8 mm(lwh) small size surface mount type ? color coordinates : x = 0.31, y = 0.32 acc. to cie 1931, at if =20ma ? viewing angle : extremely wide(110?) ? technology : ingan ? esd class(mil std-883d methode 3015.7) based on human body mod el(hbm) : 950v ? soldering methods : ir reflow soldering ? taping : 8 mm conductive black c arrier tape & antistatic clear cover tape. 3,500pcs/reel, 180 mm whee l 2. outline dimensions (unit : mm) general tolerance : 0.1
3/14 LWH1025 different and better 3. package material (1) material construction number item material 1 led chip ingan/sapphire 2 au wire 1.0mil gold wire 3 lead frame copper alloy/ni/ag plating 4 encapsulation encapsulate + yag phosphor 5 heat-resistant polymer ppa
4/14 LWH1025 different and better 4. absolute ma ximum ratings parameter symbol value unit power dissipation p d 120 mw forward current i f 30 ma * 1 peak forward current i fp 100 ma reverse voltage v r 5 v operating temperature t opr -30+85 storage temperature t stg -40+100 soldering temperature t sol 260 for 10 seconds *1.duty ratio = 1/16, pulse width = 0.1ms 5. electrical - optical characteristics characteristic symbol test condition min. typ. max. unit esd check forward voltage v f2 i f = 10ua 2.0 - - v reverse current i r v r =5v - - 10 ua * 6 half angle 1/2 i f = 20ma - 55 - deg *6. 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity (ta = 25) (ta = 25)
5/14 LWH1025 different and better 6. ranks (1) chromaticity coordinates ranks (if=20ma, ta=25) rank a rank b x 0.27 0.27 0.29 0.29 x 0.29 0.29 0.31 0.31 y 0.24 0.28 0.27 0.31 y 0.27 0.31 0.30 0.34 rank c x 0.31 0.31 0.33 0.33 y 0.30 0.34 0.33 0.37 * the cie(1931) standard colorimetric system * chromaticity coordinates measured : 0.01sr(cie. led_ b ) * measurement uncertainty of the color coordinates : 0.01
6/14 LWH1025 different and better (2) luminous intensity ranks (ta=25) iv rank test condition min. typ. max. unit r 291 405 s 405 583 t i f = 15ma 583 810 r 360 500 s 500 720 t i f = 20ma 720 1000 mcd * luminous intensity is tested a t a current pulse duration of 2 5 ms and an accuracy of 11%. * luminous intensity measured : 0.01sr(cie. led_ b ) (3) forward voltage (ta=25) test condition min. typ. max. unit i f = 15ma 3.26 3.45 i f = 20ma 3.4 3.6 v * voltages are tested at a curre nt pulse duration of 1 ms and a n accuracy of 0.1v.
7/14 LWH1025 different and better 7. taping (1) dimension of wheel((material : ps conductive, 10e9~12?) (unit : mm) (2) dimension of tape(material : ps conductive, 10e4~5?) (unit : mm)
8/14 LWH1025 different and better (3) details of chipleds loading on tape (end) (start) (4) loading quantity per reel : 3,500pcs 8. packing struction more than 40mm unloaded tape mounted with led (3,500ea) 150 ~ 380mm leading part more than 40mm unloaded tape
9/14 LWH1025 different and better 9. characteristic diagrams encapsulat (1) relative luminous intensity vs forward current (i f - iv) (3) forward current vs forward voltage(if-vf) (2) max. permissible forward current 1 10 100 2.533.544.5 forward voltage(v) forward current if(ma) 0 0.5 1 1.5 2 2.5 0 20406080 forward current(ma) relative luminosity (4) ambient temperature vs relative luminosity 0.1 1 10 -40 -20 0 20 40 60 80 100 ambient temp() relative luminosity 0 5 10 15 20 25 30 35 0 20406080100 ambient temp ta() allowable if(ma) `
10/14 LWH1025 different and better t a =25 , i f = 20ma (5) radiation characteristic t a =25 , i f = 20ma v() = standard eye response curve (4) relative spectral emission
11/14 LWH1025 different and better 10. precautions to taken (1) reflow soldering (2) for manual solder not more than 3sec @max 350, under soldering iron (3) recommendable soldering pattern(for reflow soldering)
12/14 LWH1025 different and better 11. reliability (1) the reliability criteria of smd led limit item symbol test condition min. max. forward voltage v f i f = 20ma i.v 0.8 i.v 1.2 reverse voltage v r i r = 10? lsl - luminous intensity iv i f = 20ma i.v 0.7 i.v 1.3 * i : initial value u : upper spec limit l : lower spec limit (2) results of reliability test no item test conditions test hours /cycle sample size ac/re 1 temperature cycle h : +100 30min 25 5min l : -40 30min 100 cycle 21 pcs 0/1 2 high temperature operating life temp : 85 (i f= 5ma) 1000hrs 21 pcs 0/1 3 low temperature operating life temp : -30 (i f= 20ma) 1000hrs 21 pcs 0/1 4 dc operating life temp : 24 (i f= 30ma) 500hrs 21 pcs 0/1 5 high humidity heat operating life 60/90% rh, (i f= 15ma) 500hrs 21 pcs 0/1 6 solder heat test 260, 10sec. 2 time 21 pcs 0/1
13/14 LWH1025 different and better 12. precautions in use (1) soldering conditions 1) when soldering, leave minimum clearance between the resin an d the soldering point. 2) maximum allowable soldering conditions soldering dipping : 260 degrees c max., 10 seconds max., 2 time . soldering iron : 350 degrees c m ax., 3 seconds max., 1 time, po wer 40w max. 3) contact between molten solde r and the resin must be avoided. 4) correction the soldered posit ion after soldering must be avo ided. 5) in soldering, do not apply an y stress to the lead frame, par ticularly when heated. 6) when other smd parts on the s ame circuit board and adhesive is to be cured, maximum allowable conditions are : 120 degrees c max., 60 seconds max. (2) lead forming and cut 1) lead forming must be done belo w the tie bar cutting portion. 2) when forming a lead, do not stress the resin case. 3) lead forming must be done before soldering. 4) cutting the lead frame at hig h temperature may result in per sonal injury. cut the lead frame at room temperature. (3) assembly 1) do not apply any stress to the lead frame while assembling. 2) when mounting products onto pcbs, the pitch between the moun ting holes must match the pitch of the leds. (4) static electricity 1) these products are sensitive, a high standard of care must b e used. particularly if an over- current and over-voltage which exceeds the absolute maximum rat ing of products is applied, the overflow in energy may cause damage to, or possibly result in destruction of, the products. customer shall take absolutely secure countermeasures against s tatic electricity and surge when handling products. 2) a protection device should be installed in the led driving c ircuit, which dose not exceed the max. rating for surge current during on/off switching. 3) proper grounding of products, use of conductive mat, semicon ductive workin g uniform and shoes, and semiconductive contai ners are considered to be effec tive as countermeasures against static electricity and surge. 4) a soldering iron with a grounded tip is recommended. an ioni zer should also be installed where risk of static generation is high. (5) safety precautions 1) users must comply with the la ws and public regulations conce rning safety. the light output of the products may cause injuries to human ey es in circumstances where the products are viewed directl y with unshielded eyes for more than a few seconds.
14/14 LWH1025 different and better 13. revision history sheet spec no. title specification for approval times date summary of revision remarks 1 2 3 2002. 12. 23 2003. 01. 10 2003. 03. 04 ???? iv rank ?? ??? ?? ? if=15ma ???? ??

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